Lead-free Solder Flux Paste
10 reviews

Feature :

Excellent capacity of solder-stickiness
Excellent Anti-wet Capacity
Widely used on BGA, PGA, CSP packages and flip chip operation
Suitable for multiple PCB reflow
No-clean and Lead free for environmental protection

Specifications:

Certification: CE

Model Number: 559

NC-559-ASM 100g Lead-Free Solder Flux Paste
For SMT BGA Reballing Soldering Welding Repair Paste
Model : NC-559-ASM
Volume : 100 g / bottle
It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reballing.

 Package included :

a:1 x NC-559-ASM Solder Flux Solder Paste
b:1xNC-559-ASM and 1x RMA 218
c:2x NC-559-ASM Solder Flux Solder Paste

WARRANTY

We'll refund your money if the item hasn't been delivered within 40 days after purchase. You have 2 weeks to request a refund — until day 60.
Product doesn't match the description? Contact us within 30 days after you receive it!
In case of cancellation, money will be refunded to your account within 3 days.